Thin Film Typical Hybrid
SPECIALTY RF / MICROWAVE / MILLIMETER-WAVE
COMPONENT SOLUTIONS
Home > Products > Thin-Film Technologies > Typical Hybrid Circuit Features
Typical Hybrid Circuit Features
| Typical Hybrid Circuit Features | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| Circuit Feature | Specifications | |||||||||
| Conductors: | Lines and spaces width ≥ .0005 inches | |||||||||
| Resistors: | Tolerances ≥ 0.1% | |||||||||
| Via Holes: | Conventional or Enhanced Vias® | |||||||||
| Air Bridges: | Over Lange Coupler - To eliminate need for wire bonding | |||||||||
| Crossovers: | With Polyimide over conductor lines | |||||||||
| Wraparounds: | Edge patterning | |||||||||
| Solder Dam: | Polyimide, Ni Oxide and others | |||||||||
