Thin Film General Design

General Design Guidelines

General Design Guidelines
		Hybrid (Inches)	Wafer (Micrometers)
Conductors	Minimum Line Width / Minimum Space Width	.0005	10
	Line Width Tolerance	.0002 Standard .0001 Select	±3
	Space Tolerance	.0002 Standard .0001 Select	±3
	Minimum Pad Size Around Via (D = hole diameter)	.006 + D	±10
Resistors	Minimum Tolerance	greater of 0.1% or 0.1 Ω	.01%
	Minimum Spacing Between Resistors	.002	4
	Minimum Length and / or Width	.002	4
	Pre Trim Designed Value	–20%	-20%
	Nominal Sheet Resistance (ohms / ☐ ) Preferred Sheet Resistance (ohms / ☐ )	10 – 200 50 or 100	30-1500 (ohms / ☐ )
Terminations	Minimum Pad Size (Wire Bond)	.003 x .003	75 x 75
Metalized Holes (VIA's)	Minimum Aspect Ratio (Hole diameter: Substrate thickness)	0.6:1	N/A
	Minimum Tolerance	.002
	Minimum Distance from Hole Circumference To Edge (T = substrate thickness) or adjacent hole circumference	T
	Minimum True Center Tolerance	.001
Substrates	Minimum Thickness Tolerance	.0005	10
	Minimum Length / Width Tolerance	.001	N/A
	Surface Finish (Microinch – CLA not available in all materials)	.2 – 10	.001
	Minimum Camber (Polished only) Typical Camber – Polished Typical Camber – As Fired	.0002 / inch .0005 / inch .002 / inch	10 across 150 millimeters
Data Format	DXF, DWG, GDSII, Gerber (Consult Factory For Other Formats)	All formats	DXF, GDS II
	Closed Polylines (0 Width)	Traces
	Minimum Resistor On Conductor Overlap	.002	10