Thin Film Inductors
SPECIALTY RF / MICROWAVE / MILLIMETER-WAVE
COMPONENT SOLUTIONS
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Inductors
Typical values range from 0.1 - 45 nH. The coil material consists of patterned plated copper or gold on a sputtered seed layer. The preferred substrates for hybrid assembly construction are supplied either polished or as-fired. Typical dimensions for hybrid substrate designs (in micrometers) are: 25 μm wide, 20 μm spacing at < 5 μm thick. 50 μm wide, 46 μm spacing at < 10 μm. thick, 125 μm wide, 100 μm spacing, 12.5 – 75 μm thick. See design summary below:
| Inductors | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| Construction Platform | Width (μm) | Spacing (μm) | Height (μm) | |||||||
| Hybrid | 25 | 20 | 5 | |||||||
| 50 | 46 | > 10 | ||||||||
| 125 | 100 | 75 | ||||||||
| Wafer | > 10 | > 10 | Max 20* | |||||||
| *BCB Dielectric Separator layers 5-10 μm | ||||||||||
