Combined Capabilities

• Design: Modeling (HFSS), simulation (Genesys) and CAD (Tanner)
• Substrates: 1 inch square to 6 inch round (150 mm) wafers
• Typical materials: Alumina, Aluminum Nitride, Beryllium Oxide,
  Silicon, (N, P, and N+), Quartz, Glass, Glass- Ceramic, Sapphire,
  Ferrites and Titanates
• Metalizations:
  Sputtered: Al, Au, Cr, Cu, Ni(V),
  Pt, TaN, Ti and TiW
  Plated: Electrolytic Cu, Ni, Au;
  Electroless Cu, Au
• Resistors: High Ohmic SiCr and TaN
  resistors in laser trimmable designs
• Capacitors: Si02, SiON and BCB
  dielectrics in laser trimmable designs
• Inductors: Multilevel and multiturn copper and gold inductors
• Routing: True Air Bridges and Dielectric Crossovers
• Passivation Materials: SiON, Si3N4, BCB and polyimide
• Vias: Sputtered, enhanced plated, filled and castellations
• I/Os: BGA, LGA, edge wrap, through via and wire or ribbon bond
• Machining:
  CO2 cutting, drilling, and scribing
  Diamond-saw dicing
  Back grinding and polishing
• Assembly:
  High precision 0201 or larger pick and place
  Attachment via wire or ribbon bonding, BGA, LGA
  or surface mount reflow
  Encapsulation
• Testing:
  MIL-STD-105D level II sampling
  MIL-STD-883 100% visual inspection
  Capacitance, insulation resistance and resistivity
  RF testing to 40 GHz

Primary Markets and Applications

• Military, Aerospace and Space:
  RF and Microwave filters
  Precision resistors
  MOS capacitors
  Circulators, Splitters
  Specialized modules
• Medical and Instrumentation:
  Precision resistor networks and arrays
  In-circuit trimmed designs
  Telemetry filters
  Miniature circuits and assemblies
• Broadband infrastructure:
  Laser diode mounts and heat sinks
  Optoelectronic converters
  RF and DC fan-outs
• Instrumentation:
  Ultra-precision reference capacitors and resistors
• Solar:
  Interposers and heat sinks